SPIL 【矽品精密】
各項積體電路封裝之製造、加工、買賣及測試等相關業(yè)務。Besides the conventional SOP and QFP packages, SPIL has been devoted to the development of wafer thinning, fine-pitch wire bonding, stacked-die bonding, wafer bumping and flip-chip assembly technologies in order to realize advanced packages like: QFN, PBGA, TFBGA, Stacked-die CSP, WLCSP, Memory card and FCBGA.
In order to meet our customers future packaging requirements, we are continuously developing the next generation assembly technologies. Currently studies inclu...
官方網(wǎng)址:http://www.spil.com.tw>